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Q. |
How a uniform film with good crystal structure is attained in cathode sputtering process? |
A. | by hitting high energy particle directly on the substrate |
B. | allowing less time for the particles to deposit on the substrate |
C. | high energy particle diffuse through low pressure gas and deposits on the substrate |
D. | heavy inert gas is used for film deposition on the substrate |
Answer» C. high energy particle diffuse through low pressure gas and deposits on the substrate | |
Explanation: the process of cathode sputtering is performed at a low pressure (about 10-12 torr). so, when the high energy particle landing on the substrate actually results in a very uniform film and adhesion. |
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