[Solved] During Chemical milling, depth of etch is controlled by which factor of immersion?

McqMate

Q.	During Chemical milling, depth of etch is controlled by which factor of immersion?
A.	time
B.	mask method
C.	mask area
D.	none of the mentioned
Answer» A. time
Explanation: as the immersion time increases, depth of the etching increases.

1.7k

0

Do you find this helpful?

15

View all MCQs in

Unconventional Machine Process (UMP)

Discussion

No comments yet

Related MCQs

State whether the following statement about Chemical milling is true or false. “At higher temperatures, faster etching rates occur in Chemical milling.”
Of the following, which ratio defines the etch factor?
In Chemical milling, excessive flow of chemical reagent results in which of the following defects?
State which of the following statement is true or false regarding Chemical milling. “Maskants are generally used in CHM, to protect the work piece from the etching chemical agent.”
What are the tolerance values achieved in Chemical milling, which depend on work piece material and depth of cut?
State whether the following statement regarding the limitations of CHM. “Welded areas etch, at a rate that is same as base metal.”
Of the following, which mechanism is used for the removal of material using Chemical milling process?
Which of the following are the tools required for Chemical milling?
Which of the following can be used to apply the maskants on work piece in Chemical milling?
Which of the following, are the main uses of etchants applied in Chemical milling?