McqMate
These multiple-choice questions (MCQs) are designed to enhance your knowledge and understanding in the following areas: Mechanical Engineering .
| 401. |
What are the disadvantages of PBM? |
| A. | large power supplies |
| B. | heat produced |
| C. | toxic fumes produced |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: large power for more thick materials, production of heat and toxic fumes are some of the main disadvantages of pbm | |
| 402. |
What is the full form of EBM in the advanced machining processes? |
| A. | electro blast manufacturing |
| B. | electron beam machining |
| C. | electron beam manufacturing |
| D. | electron blast manufacturing |
| Answer» B. electron beam machining | |
| Explanation: the full form of ebm is electron beam machining in the advanced machining processes. | |
| 403. |
Which of the following are the applications of EBM process? |
| A. | drilling |
| B. | cutting |
| C. | engraving |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: drilling small holes, cutting, engraving, and heat treatment are some of modern applications of electron beam machining. | |
| 404. |
What are the values of currents used in EBM process? |
| A. | 1 and 20 ma |
| B. | 20 and 100 ma |
| C. | 100 and 200 ma |
| D. | 200 and 400 ma |
| Answer» B. 20 and 100 ma | |
| Explanation: the values of the currents used in the electron beam machining process are between 20 and 100 ma. | |
| 405. |
What are the values of current densities used in the process of EBM? |
| A. | 5 and 15 a/cm2 |
| B. | 15 and 20 a/cm2 |
| C. | 20 and 30 a/cm2 |
| D. | 40 and 60 a/cm2 |
| Answer» A. 5 and 15 a/cm2 | |
| Explanation: the values of the current densities used in ebm lie between 5 and 15 a/cm2. | |
| 406. |
Emission current depends up on which of the following factors? |
| A. | cathode material |
| B. | temperature |
| C. | voltage supply |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: emission current depends on the cathode material, temperature, and the high voltage in the process of electron beam machining. | |
| 407. |
What are the values of voltages used in the EBM process? |
| A. | 10 v |
| B. | 50 v |
| C. | 150 v |
| D. | 200 v |
| Answer» C. 150 v | |
| Explanation: the values of voltages used in the process of electron beam machining is about 150 v. | |
| 408. |
Which of the following lenses are used for refocussing the electrons in EBM process? |
| A. | magnetic lens |
| B. | electronic lens |
| C. | magnetic & electronic lens |
| D. | none of the mentioned |
| Answer» C. magnetic & electronic lens | |
| Explanation: magnetic and electronic lenses are used to refocus the electrons in ebm process. | |
| 409. |
What are the values of power densities used in the EBM process? |
| A. | 0.05 mw/mm2 |
| B. | 0.55 mw/mm2 |
| C. | 1.55 mw/mm2 |
| D. | 2.55 mw/mm2 |
| Answer» C. 1.55 mw/mm2 | |
| Explanation: the value of the power densities used in the process of electron beam machining are about 1.55 mw/mm2. | |
| 410. |
What is the frequency of the pulse of electrons used in EBM process? |
| A. | 10 hz |
| B. | 102 hz |
| C. | 103 hz |
| D. | 104 hz |
| Answer» D. 104 hz | |
| Explanation: a pulsed electron beam at 104 hz reduces the temperature of the work piece outside the region being machined. | |
| 411. |
What are the values of material removal rates in EBM process? |
| A. | 1 mm3/min |
| B. | 10 mm3/min |
| C. | 100 mm3/min |
| D. | 1000 mm3/min |
| Answer» B. 10 mm3/min | |
| Explanation: the values of the material removal rates in the process of electron beam machining are about 10 mm3/min. | |
| 412. |
What are the values of the cavity diameters that are obtained in EBM? |
| A. | 15 to 20 µm |
| B. | 20 to 25 µm |
| C. | 30 to 35 µm |
| D. | 35 to 40 µm |
| Answer» D. 35 to 40 µm | |
| Explanation: the values of the cavity diameters range from 35 to 40 µm | |
| 413. |
Which of the following are the applications of EBM? |
| A. | hole drilling |
| B. | slotting |
| C. | perforation of thin sheets |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: drilling, perforation of thin sheets, slotting and integrated circuit fabrication are some of the applications of electron beam machining. | |
| 414. |
What is the value of largest diameter of the hole drilled on EBM? |
| A. | 0.5 mm |
| B. | 1.0 mm |
| C. | 1.5 mm |
| D. | 2.0 mm |
| Answer» C. 1.5 mm | |
| Explanation: the maximum value of diameter that can be drilled using electron beam machining is about 1.5 mm. | |
| 415. |
What is the value of maximum depth of the hole drilled on EBM? |
| A. | 10 mm |
| B. | 20 mm |
| C. | 30 mm |
| D. | 40 mm |
| Answer» C. 30 mm | |
| Explanation: value of the maximum depth that can be drilled using electron beam machining is about 10 mm. | |
| 416. |
What is the value of energy required for bond breaking? |
| A. | 10 to 20kv |
| B. | 20 to 30kv |
| C. | 30 to 40kv |
| D. | 40 to 50kv |
| Answer» A. 10 to 20kv | |
| Explanation: value of the beam energy used for breaking bonds or cross linking them range from 10 to 20kv. | |
| 417. |
1 and 16000 Hz in Electron beam machining. |
| A. | ± 10 % |
| B. | ± 20 % |
| C. | ± 30 % |
| D. | ± 40 % |
| Answer» A. ± 10 % | |
| Explanation: the tolerances obtained in electron beam machining is about ± 10 % of the depth of cut. | |
| 418. |
Which of the following are the advantages of EBM process? |
| A. | drilling rates |
| B. | no distortion |
| C. | high accuracy |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: the main advantages of electron beam machining are high drilling rates, no mechanical distortion, high accuracy and repeatability. | |
| 419. |
There is no limitation imposed on which of the following factors in EBM? |
| A. | material ductility |
| B. | surface hardness |
| C. | surface reflectivity |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: in electron beam machining, no limitation is imposed by work piece hardness, ductility, and surface reflectivity. | |
| 420. |
How much is the capital equipment cost of equipment used in EBM? |
| A. | very low cost |
| B. | low cost |
| C. | moderate cost |
| D. | high cost |
| Answer» D. high cost | |
| Explanation: the capital equipment cost of the electron beam machining is high compared to other machining processes. | |
| 421. |
How are the production times for a material in electron beam machining? |
| A. | very small |
| B. | small |
| C. | moderate |
| D. | long |
| Answer» D. long | |
| Explanation: in electron beam machining, long production times are required due to the generation of vacuum in the chamber for machining purpose. | |
| 422. |
Which type of thin cast layer is produced when we use EBM? |
| A. | thin layer |
| B. | thick layer |
| C. | no layer |
| D. | all of the mentioned |
| Answer» A. thin layer | |
| Explanation: thin recast layer is produced in electron beam machining which an added disadvantage to the machining process | |
| 423. |
In advanced machining processes, what is the full form of CHM? |
| A. | chemical machining |
| B. | chemical manufacturing |
| C. | chemical milling |
| D. | none of the mentioned |
| Answer» C. chemical milling | |
| Explanation: in advanced machining processes, full form of chm is chemical milling. | |
| 424. |
Of the following, which mechanism is used for the removal of material using Chemical milling process? |
| A. | material vaporization |
| B. | chemical dissolution |
| C. | mechanical erosion |
| D. | mechanical abrasion |
| Answer» B. chemical dissolution | |
| Explanation: chemical dissolution takes place in chemical milling for the removing the material. | |
| 425. |
Which of the following solutions cannot be used as chemical reactive solution in CHM? |
| A. | acidic solution |
| B. | alkaline solution |
| C. | neutral solution |
| D. | none of the mentioned |
| Answer» C. neutral solution | |
| Explanation: both acidic or alkane solutions are used for chemical dissolution in chemical milling. | |
| 426. |
By using Chemical machining, which of the following can be produced? |
| A. | pockets |
| B. | contours |
| C. | slots |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: by the use of chm, pockets, contours, slots and materials having high strength to weight ratio can be machined. | |
| 427. |
Pre cleaning is done on the work piece surface in order to achieve, which of the following factors? |
| A. | to provide good adhesion |
| B. | to provide clean surface |
| C. | to assure the absence of contaminants |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: all the factors mentioned above, are achieved thorough pre-cleaning process. | |
| 428. |
Special coatings applied on work piece materials in order to protect them from chemical reaction are known as |
| A. | maskants |
| B. | protective coverings |
| C. | protective varnishing |
| D. | none of the mentioned |
| Answer» A. maskants | |
| Explanation: the protective coatings on work pieces are known as maskants. | |
| 429. |
Type of mask depends on which of the factor/s, given below? |
| A. | size of work piece |
| B. | number of parts |
| C. | desired resolution |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: all the factors mentioned above, are required to select the type of mask. | |
| 430. |
During Chemical milling, depth of etch is controlled by which factor of immersion? |
| A. | time |
| B. | mask method |
| C. | mask area |
| D. | none of the mentioned |
| Answer» A. time | |
| Explanation: as the immersion time increases, depth of the etching increases. | |
| 431. |
What is the range of reagent temperatures used for chemical dissolution in CHM? |
| A. | 12ᵒc to 35ᵒc |
| B. | 37ᵒc to 85ᵒc |
| C. | 90ᵒc to 101ᵒc |
| D. | 121ᵒc to 142ᵒc |
| Answer» B. 37ᵒc to 85ᵒc | |
| Explanation: the optimum temperature of reagent used should range between 37ᵒc to 85ᵒc. | |
| 432. |
In Chemical milling, excessive flow of chemical reagent results in which of the following defects? |
| A. | channellings |
| B. | grooves |
| C. | ridges |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: in chemical milling, if the reagent flows excessively, then the defects mentioned above may occur. | |
| 433. |
State whether the following statement about Chemical milling is true or false. “At higher temperatures, faster etching rates occur in Chemical milling.” |
| A. | true |
| B. | false |
| Answer» A. true | |
| Explanation: as the temperature increases, reaction rate increases which in turn increases etching rate in chm. | |
| 434. |
Of the following, which ratio defines the etch factor? |
| A. | etching depth to undercut |
| B. | undercut to etching depth |
| C. | undercut to mask area |
| D. | mask area to undercut |
| Answer» B. undercut to etching depth | |
| Explanation: etch factor is defined as the ratio of undercut to etching depth. | |
| 435. |
CHM cannot eliminate which of the following defects? |
| A. | irregularities and dents |
| B. | surface scratches |
| C. | waviness |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: chm is not a finishing process as that of maf, there are some sort of defects in chemical milling | |
| 436. |
Which of the following are the tools required for Chemical milling? |
| A. | maskants |
| B. | etchants |
| C. | scribing plates |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: all the components mentioned above, are required to carry out chemical milling process. | |
| 437. |
State which of the following statement is true or false regarding Chemical milling. “Maskants are generally used in CHM, to protect the work piece from the etching chemical agent.” |
| A. | true |
| B. | false |
| Answer» A. true | |
| Explanation: in chm, maskants are used to protect the work piece from chemical agents. | |
| 438. |
Which of the following are the materials used for making maskants? |
| A. | synthetic materials |
| B. | rubber materials |
| C. | polymeric materials |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: all the materials mentioned above, can be used for making maskants. | |
| 439. |
What are the properties that a maskant used in Chemical milling should possess? |
| A. | be tough and adhere well |
| B. | scribe easily |
| C. | be inert to chemical reagent |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: all the properties mentioned above, should be possessed by the maskants. | |
| 440. |
Which of the following can be used to apply the maskants on work piece in Chemical milling? |
| A. | dipping or spraying |
| B. | rolling or electro coating |
| C. | adhesive tapes |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: maskants can be applied to work piece, by the above mentioned means. | |
| 441. |
State whether the following statement is true or false regarding maskants. “After etching, maskants should be removed easily and inexpensively.” |
| A. | true |
| B. | false |
| Answer» A. true | |
| Explanation: after etching is done, maskants should be removed easily by inexpensive means. | |
| 442. |
In maskant application, photo-resist masks ensure which of the following advantages? |
| A. | high accuracy |
| B. | ease of repetition |
| C. | ease of modification |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: we will have the advantages which are mentioned above, if we use photo resist masking. | |
| 443. |
Which of the following, are the main uses of etchants applied in Chemical milling? |
| A. | good surface finish |
| B. | uniform material removal |
| C. | control intergranular attack |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: in chm, etchants are used for the above mentioned factors. | |
| 444. |
State whether the following statement is true or false about etchants. “Etchants are used for controlling H2 absorption in case of Ti alloys.” |
| A. | true |
| B. | false |
| Answer» A. true | |
| Explanation: etchants control the h2 absorption in ti alloys. | |
| 445. |
Scribing plates are used to define, which of the following parameters in Chemical milling? |
| A. | areas to be exposed |
| B. | volumes to be exposed |
| C. | areas not to be exposed |
| D. | volumes not to be exposed |
| Answer» A. areas to be exposed | |
| Explanation: scribing plates defines the areas that are to be exposed for removal of material. | |
| 446. |
Which of the following are can be used as guides for scribing process in Chemical milling? |
| A. | layout lines |
| B. | simple templates |
| C. | fibre glass |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: all the guides mentioned above, can be used for scribing process. | |
| 447. |
Which of the following are the accessories, included in the tooling of Chemical milling? |
| A. | tanks and hooks |
| B. | brackets and racks |
| C. | fixtures |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: the accessories mentioned above are included in the tooling of chemical milling. | |
| 448. |
Which of the following come under process parameters of Chemical milling? |
| A. | reagent type |
| B. | concentration |
| C. | operating temperature |
| D. | all of the mentioned |
| Answer» D. all of the mentioned | |
| Explanation: all the parameters mentioned above, are different process parameters required for chemical milling. | |
| 449. |
State whether the following statement is true or false about Chemical milling. “Maskants, applied on work pieces, are not responsible for CHM process.” |
| A. | true |
| B. | false |
| Answer» B. false | |
| Explanation: maskants are also responsible for process to take place in chemical milling. | |
| 450. |
To machine high quality parts using CHM, which of the following need not be necessary? |
| A. | heat treatment of work piece |
| B. | grain size of work piece |
| C. | frequency of vibrations |
| D. | range of work pieces |
| Answer» C. frequency of vibrations | |
| Explanation: to machine high qualities products vibrational frequency is not necessary in chm. | |
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